Micro-Electronics Commons Bridging the Gap from LAB to FAB

Microelectronics Commons

The Commons is designed to:

Enable

Enable sustained partnerships between emerging technology sources, manufacturing facilities, and interagency partners

DEVELOP

Develop a pipeline of talent to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce

BRIDGE

Bridge the microelectronics technological "Valley of Death"

EXPAND

Expand domestic microelectronics fabrication capability

ENHANCE

Enhance the microelectronics education and training pipeline to bolster the microelectronics engineering workforce

The Microelectronics Commons program comprises eight regional Hubs, each managing its network of commercial innovators.

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Microelectronics Commons Prototyping Projects by Technology Area

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Secure Edge/Internet of Things (IoT) Computing:

secure microelectronics solutions addressing new approaches to reducing size, weight, and power (SWaP) on battlefield platforms for fast decision-making

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Quantum Technology:

prototypes for emerging platforms and materials; quantum chips and integration; and test and measurement capability

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AI Hardware Technologies:

high performance, energy efficient, reconfigurable, and scalable hardware; emerging processing hardware; test and measurement capability; and software stack

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5G/6G Technology:

next-generation wireless networking technologies for the decentralized, anytime-anywhere communications networks that yield asymmetric warfighting results

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Electromagnetic Warfare:

commercial off-the-shelf technologies, and development of computing technologies that will be suitable for use at the tactical edge.

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Commercial Leap Ahead Technologies:

accelerating pathways for commercialization of innovative microelectronic technologies in which the commercial industry has little to no current business investment

Office of the Under Secretary of Defense,
Research and Engineering (OUSD(R&E))
3030 Defense Pentagon, Washington, DC 20301-3030