Trusted & Assured Microelectronics

To meet current operational needs for the Department of Defense, the Trusted and Assured Microelectronics (T&AM) Program drives modernization of defense systems through access to advanced microelectronics technologies that leverage state-of-the-art (SOTA), commercially driven capabilities. The T&AM Program identifies and works to mitigate persistent threats throughout the microelectronics supply chain. From design to final package delivery, the T&AM Program uses a Quantifiable Assurance zero-trust based method to drive growth of the domestic supply chain and alleviate the DoD’s reliance on sole source foundries. Under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)), T&AM has undertaken multiple efforts to advance warfighter technology and strengthen our country’s defenses.

Objectives

Support microelectronics modernization and leverage state-of-the-art (SOTA) commercially-driven technology to obtain the best available products
Mitigate persistent threats to microelectronics lifecycle
Address entire microelectronics supply chain from design through final package delivery and advocate for U.S. based capabilities.
Use Quantifiable Assurance zero-trust based method to assure DoD supply chain and apply across microelectronics supply chain for legacy and SOTA technology
Reduce reliance on obsolete microelectronics
Alleviate DoD’s reliance on sole source foundries for assured SOTA microelectronics

Technical Execution Areas

The T&AM Program actively engages with policy and industrial representatives on a regular basis and serves as the Technical Execution Lead for the Strategic Radiation-Hardened Electronics Council (SRHEC). The T&AM Program consists of six Technical Execution Areas:

Access to Advanced Packaging and Test

The Advanced Packaging and Test Technical Execution Area is focused on designing and validating a sustainable model for access to customized state-of-the-art packaging using standard commercial flows. This includes the following key lines of effort:

SHIP: State-of-the-Art Heterogeneous Integrated Packaging

STAMP: Stimulating Transition for Advanced Microelectronics Packaging

STEAM PIPE: Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem

See the section below to learn more about each of these efforts.

Access to SOTA Microelectronics

Access to Radiation Hardened (RadHard) Microelectronics

Access to SOTA Radiofrequency (RF)/Optoelectronics (OE) Microelectronics

The Access to SOTA Radio Frequency- & Opto-Electronics (RF/OE) Microelectronics Technical Execution Area supports two main strategic goals. First, RF/OE accesses, matures, and assures state-of-the-art manufacturing capabilities for RF Gallium Nitride and Photonic Integrated Circuits. This directly enables domestic manufacturing of next generation sensors and communication devices. Secondly, RF/OE develops, demonstrates, and transitions state-of-the-art devices and Intellectual Property via rapid prototyping. This drives affordability and innovation into the Defense Industrial Base, and enables Spectrum Dominance for the Warfighter.

Education and Workforce Development

Microelectronics Assurance

Advanced Packaging and Test Technical Execution Area

State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program

The State-of-the-Art Heterogeneous Integrated Packaging Program (or “SHIP”) falls under the Access to Advanced Packaging and Test Technical Execution Area and tackles the issue of DoD’s low-volume, high-mix requirements by leveraging commercial industry advanced packaging capabilities to realize size, weight, and power (SWAP) savings and increase system performance. The SHIP Program is part of a broader effort to enhance U.S.-based, secure, and economically viable capabilities to provide the technologies necessary to success of our warfighters.

The SHIP Program focuses on the development, delivery, and eventual transition of prototype devices into DoD systems, while demonstrating significant SWAP reductions. These initiatives are rooted in partnership between the U.S. Government, microelectronics industry leaders, and the Defense Industrial Base (DIB). Requirements were based on known threats being addressed by the lead DIB partners in an effort to drive wider modernization of DoD systems and maintain U.S. advantage. The SHIP Program is also developing a business model for the DoD to gain sustained access to customized SOTA parts in a standard commercial flow and work with the lead DIB partners for each device to make these new technologies available for a wider DoD application.

More information on the SHIP Program can be found on NSTXL’s Opportunities page. (click image for larger version)

Stimulating Transition for Advanced Microelectronics Packaging (STAMP)

The Stimulating Transition for Advanced Microelectronics Packaging (STAMP) opportunity aims to provide opportunities for rapid transition of advanced packaging devices developed under the SHIP program. While the initial phases of SHIP program obligations end with the delivery of prototypes to the lead DIB partner, STAMP serves as the next phase of the effort—reaching past typical prototyping efforts to champion transition of devices to DoD systems.

The STAMP opportunity helps the DoD modernize military systems in partnership with the Defense Industrial Base by creating a cost sharing model and aligning programs to buy down risks associated with adopting new technology.

STAMP requires alignment to an existing DoD Program Office via existing Defense Industrial Base relationships and includes cost sharing to reduce the risk for adoption of devices and programs. Even though the device designs were developed in partnership with one lead Defense Industrial Base partner, the designs were based on known threats and requirements to ensure wide applicability across DoD systems. These prototypes can impact a wide range of military systems through increased performance and capability due to significant SWAP savings and are at the core of driving rapid transition and technology adoption for the DoD.

More information on the STAMP Program can be found on NSTXL’s Opportunities page.

(click image for larger version)

Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

The Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) supports and supplements the vision of the SHIP Program to continue developing a U.S.-based, economically viable SOTA heterogeneous integration and packaging capability. STEAM PIPE provides a unique opportunity to develop more capability, more prototype chiplets, and more prototype devices that are critical to delivering next generation capabilities to the warfighter. STEAM PIPE integrates transition from the very beginning of contract award and offers new contract opportunities for prototyping packaged devices and/or chiplets at a regular cadence.

Through STEAM PIPE, the government can award projects for either chiplet design and development or packaged device design and development resulting in prototype devices. The program lays out a three phased approach that includes design and development of chiplets and packages, fabrication, and potential cost-sharing collaboration to ensure the successful transition of devices into DoD systems. STEAMP PIPE will strengthen the domestic packaging ecosystem and shape collaborative efforts to advance the technologies needed to maintain U.S. warfighting advantage.

More information on the STEAM PIPE Program can be found on NSTXL’s Opportunities page.